Thermal Interface Material Thickness

As an industry leader in high performance cost effective thermal interface materials tims and technologies laird designs and manufactures thermal products including gap fillers and putties phase change materials thermal greases and thermally conductive insulator materials that meet the demands interface materials tims and technologies laird designs and.

Thermal interface material thickness.

While a thermal resistance value quoted for a specific tim part number quite predictably refers to the thickness of that. One microprocessor supplier recommends only two thermal interface materials for interfacing its latest product with a heat sink and both are recently developed greases 2. Thermal interface materials tims for example thermal conductive gap filling materials are widely used in electronic packaging to reduce the thermal contact resistance caused by the interfacial air whose volume content and thermal conductivity k can be as high as 99 and as low as 0 026 w m 1 k 1 respectively. 65 products found filter applied thickness 1mm.

It is ideal for large area thermal interface requirements such as igbts which can benefit from the 0 010 thickness. It is also helpful for die cast heat sinks with poor planarity. Thermal interface materials tims are a category of products used to aid thermal conduction between mechanically mated surfaces such as a semiconductor device and a heat sink. Hsmf is a compressible thermal interface materials made of a non silicone based polymer.

Polymerized silicone rubbers in the form of easy to handle solids.