Thermally Conductive Epoxy Potting

Our chemists and application engineers have developed polymer formulations that provide various cure schedules viscosities and fast continuous heat dissipation for a variety of electronic and.

Thermally conductive epoxy potting.

3m thermally conductive epoxy adhesive tc 2707 is a thermally conductive 2 part epoxy using aluminum metal fillers for good thermal conductivity with high adhesion. A thermally conductive epoxy epoxy resin for use with hardeners b thermally conductive epoxy epoxy hardener for use with resins safety data sheets for each part listed above follow this cover sheet. Is a leading manufacturer of thermally conductive epoxies urethanes and silicones. A black electrically isolating thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies transformers and coils.

Low viscosity for potting application. Formulated with undiluted bis f resin for superior physical properties and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost. Epoxyset specializes in manufacturing highly engineered thermally conductive potting compounds. Thermally conductive adhesives and potting compounds epoxies etc.

Low viscosity for potting application. Thermally conductive epoxy encapsulating and potting compound. 3m thermally conductive epoxy adhesive tc 2810 is a thermally conductive 2 part epoxy using boron nitride bn filler for good thermal conductivity with high adhesion. Used in today s most challenging environments such as automotive and aerospace where thermal conductivity and operating temperature boundaries are pushed to the limit potting materials deliver enhanced mechanical strength provide electrical insulation and improve thermal reliability.

Our products range from room temperature cure to high temperature and vary in viscosities to suit your application. It is a low viscosity alternative to er2220 system which is ideal for potting and encapsulating electronics or components with limited spacing and. Formulated with various different conductive fillers our products are designed to offer maximum thermal. Good thermal conductivity 1 0 1 4 w m k low cl ion content and outgassing.

Good thermal conductivity 0 72 w m k low cl ion content and outgassing. Epic s7133 has been designed with a convenient 1 1 mix ratio by weight or volume and uses a less abrasive filler making s7133 suited for meter mix dispense applications. Pigmented black for excellent thermal absorption and emission.