Thermal Compound For Heat Sink

Thermal paste is an example of a thermal interface material.

Thermal compound for heat sink.

Wells heat sink compound 1 ea. Will not harden or melt. This is a test. Will not react to rubber or plastic.

Since the grooves between the heatsink and the processor aren t perfectly even the thermal compound is perfect for use as a conduit to facilitate better heat transfer. Temperature range from 45 degrees f to 500 degrees f. These compounds are commonly used with transistors diodes rectifiers and transformers. Silicone compound blended with thermally conductive fine metal oxide powders.

Thermal paste is a thermally conductive chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices. Zinc oxide compounds create a more secure bond than silicone compounds. Parts are just part of what we do. Wigbow thermal compound paste heatsink paste carbon based high performance thermal compound cpu for all coolers thermal interface material high durability 4 grams 1 pack 4 6 out of 5 stars 315 6 99 6.

As opposed to thermal adhesive thermal paste does not add mechanical strength to the bond between heat source and heat s. Super lube silicone heat sink 3 oz. Excellent heat transfer efficiency. The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation.

Diysave10 online ship to home orders only. All the energy is absorbed by the cpu grease to ensure it only flows to the heatsink and not to any of the computer s internal circuitry something that is of particular importance for gaming pcs. Heat sink compounds bond heat sinks to surfaces eliminating air gaps for maximum heat transfer.